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When your prototype layout demands copper on both sides and a clean photosensitive surface, sourcing the right substrate can derail an entire build. Makers, electronics hobbyists, and small-batch PCB fabricators who need a dependable double sided copper clad sheet will find this board ready to expose, etch, and drill without the guesswork of inconsistent raw stock.
Each piece is a double sided copper clad laminate with a photo-sensitive (pre-sensitized) coating applied to both copper faces. Boards are available in eight cut sizes ranging from 5×7 cm (approx. 2"×2.75") up to 20×30 cm (approx. 7.9"×11.8"), and can be ordered in quantities from 1 to 50 pieces per variant. The copper layer thickness is typically in the 35 µm (1 oz/ft²) range; substrate thickness is typically 1.0–1.6 mm depending on the size option selected.
Typical use cases include DIY single-run PCB fabrication using UV exposure and ferric chloride etching, rapid prototyping of analog or digital circuits for maker workshops, and educational electronics projects where students practice photolithography and circuit layout on a double sided copper clad board.
| Board Type | Double Sided Copper Clad Laminate |
|---|---|
| Surface Treatment | Photo-sensitive (pre-sensitized) resist on both sides |
| Available Sizes (cm) | 5×7, 7×10, 8×12, 10×10, 10×15, 12×18, 15×20, 20×30 |
| Available Sizes (inches, approx.) | 2"×2.75" up to 7.9"×11.8" |
| Copper Layer Thickness | Typically 35 µm (1 oz/ft²) — see variant options |
| Substrate Thickness | Typically 1.0–1.6 mm — see variant options |
| Quantity per Order | 1 / 2 / 3 / 5 / 8 / 10 / 15 / 20 / 25 / 30 / 40 / 50 PCS |
| Edge Finish | Guillotine shear-cut |
| Compatible Etchants | Ferric chloride, sodium persulfate |
| Exposure Method | UV light source (exposure unit or sunlight) |
| Product Type | Copper Sheet / PCB Substrate |
An Arduino Uno shield footprint is approximately 68×53 mm. The 7×10 cm (70×100 mm) or 8×12 cm (80×120 mm) boards both provide enough clearance for the shield outline plus a small border for handling. If you need extra routing space or plan to add peripheral circuitry, the 10×15 cm option gives more room without excessive waste.
The copper foil is bonded to the substrate under heat and pressure during lamination, producing a peel strength typically consistent with standard FR-4 / phenolic copper clad laminates. When etching times and etchant concentrations are kept within normal ranges (ferric chloride at room temperature, agitated), delamination is not expected. Over-etching or excessive heat during soldering can weaken the bond over time, which is normal for any copper clad board.
The pre-applied resist is sensitive to UV light and should be stored away from direct sunlight and fluorescent lighting. Keep boards in their original opaque packaging in a cool, dry location. Humidity can degrade the resist layer over time, so use boards within a reasonable period after opening. If the resist appears discolored or uneven before exposure, the board's sensitivity may be compromised.
Yes. The photo-sensitive process can resolve fine traces suitable for many SMD footprints, depending on the quality of your artwork film and UV exposure unit. For fine-pitch ICs (0.5 mm pitch and below), a high-resolution laser-printed transparency or professional film output and a collimated UV source will yield the best results. Through-hole and standard SMD prototyping (0805, SOT-23, SOIC) are well within the capability of this process.
Standard PCB carbide drill bits in the 0.8–3.2 mm range work well with these substrates. HSS (high-speed steel) bits can be used for occasional drilling but wear faster than carbide on fiberglass-based laminates. Drill at moderate speed with light feed pressure to avoid delamination around the hole. A drill press or PCB drill stand is recommended over hand drilling for accurate hole placement.
If you are prototyping a new design for the first time, starting with 1–2 pieces lets you validate the layout before committing to more stock. For classroom use, workshop batches, or designs you plan to iterate on, ordering 5–15 pieces reduces per-unit cost and ensures you have spares if an exposure or etching step needs to be repeated. Larger packs (20–50 PCS) are suited for small production runs or group projects where multiple identical boards are needed.
A diluted sodium hydroxide (NaOH) solution — typically 5–10 g per liter of water — is the standard developer for most pre-sensitized photo-resist boards. Sodium carbonate (washing soda) solution is a milder alternative. Develop at room temperature, agitating gently until unexposed resist dissolves and the copper pattern is clearly visible. Rinse thoroughly with clean water before proceeding to etching.
